1. 連續式溼製程鍍膜種類及厚度上限
Hard Gold (Au)
1μ-100μ
Wire Bondable Gold (Au)
1μ-100μ
Soft Gold (Au)
1μ-30μ
Palladium-Nickle (Pd-Ni)
15μ-100μ
Silver (Ag)
80μ-250μ
Copper (Cu)
50μ-100μ
Matt Nickle (Ni)
30μ-150μ
Semi-bright Nickle (Ni)
30μ-150μ
Bright Pure Tin (Sn)
40μ-250μ
Matt Pure Tin (Sn)
40μ-250μ
Chemical Lubrication
Pore Protection Boosting
2. 板材選擇電鍍製程能力
Location tolerance
±0.1mm
Number of Location
Multiple
3. 黑色陶瓷複合材規格
Sheet resistance (Glass substrate)
5Ωmin by Four Point Probe
Sheet resistance (Nickel substrate)
0.5mΩmin by Four Point Probe
Reflectivity
15-40 by PL Spectrometer
Film thickness
200nm-700nm
4. 銅電鑄特性及能力
Thickness
Max 500μ
Max size allowed
550x450 mm
5. 鎳電鑄特性及能力
Internal stress
＜50MPa
Hardness
150-170Hv
Thickness
Max 500μ
Max size allowed
550x450 mm
6. 溼製程適用基材
Copper & its alloys (non-toxic)
Copper beryllium
Steel
Stainless steels
Nickel
Nickel alloys
Aluminum & its alloys (Batch process)
Zinc & its alloys (Die-casting / Batch process)
7. PVD製程適用基材
Copper & its alloys (non-toxic)
Copper beryllium
Steel
Stainless steels
Nickel
Nickel alloys
Aluminum & its alloys (Batch process)
Zinc & its alloys (Die-casting / Batch process)
Glass
PC/ABS/PET/PBT/Nylon/Acrylics/PI/PEEK...